T5 Pro-Grade+
Thermal Compound ProGrade Plus T5
Ultra-performance thermal paste for your CPU or GPU for superior heat transmission to the heatsink. Composed of nano-diamond particles for exceptional thermal conductivity. Perfect for overclocking enthusiasts and high-end systems.
|
• Designed with hybrid silicone and
nano-diamond particles for ultra-performance • Non-curing and non-electrically conductive properties • Conveniently included wipes and spreader Nano-Diamond Particles for Superior Heat Transmission Use of hybrid silicone and nano diamond micro particles ensures
minimal thermal resistance for quick and efficient heat transmission. Getting the most out of your processor, air and liquid heatsink cooler. Making it perfect for overclockers. Performance Comparison Under 100% Load
(Lower is Better) Easy and Safe Application
Non-curing paste means no time required to wait for curing process
reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components. Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on
CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink. |
| Application | Thermally conductive compound |
|---|---|
| Thermal Conductivity | 5.2 W/mK |
| Specific Gravity | 2.6 |
| Form | Non-curing compound |
| Operating Temperature | -50°C to 250°C |
| Thermal Impedance | 0.04 (°C-cm²/W) @ 60 psi |
| Colour | Grey |
| Viscosity | 6,000,000 (mPa.s/ 22°C) |
| Weight | 5g |
| Product Code | AK-T565-5G |
