Turing TN
Compact fanless
case

for Intel® 11th Generation NUC
• Aluminium fanless cooling design
• Stylish cover panels with diamond effect
• Internal M.2 SSD heatsink
• Positioned vertically or horizontally
• Suitable for Core i3, i5 and i7 with vPro Technology
(Tiger Canyon NUCs) up to Intel's specification of 28W TDP
Superb Cooling Performance
Excess heat from CPU and GPU dies are effectively transferred from the
thermal modules to the all-aluminium body which acts as a heatsink
to dissipate the heat to the surrounding. Ensuring the system runs at
optimal thermal performance.
Cool Storage, Cool Performance
Internal M.2 SSD heatsink reduces heat and enhances performance.
Contemporary and Made-to-Last Design
Aluminium case provides durability and long-lasting use. Coupled with
symmetrically extruded fins and striking classical inspired panels for
stunning aesthetics and functionality, which means the case look great
in any environment.
Contemporary design
Ideal for home and business applications from digital signage to
home-theatre setups and more.
Supports up to Four 4K Displays
The Turing TN case provides connector openings for connectivity of
four 4K displays. Perfect for an array of business applications such as
security and digital signage.

 

Material Aluminium
Motherboard Types UCFF 4" X 4"
Motherboard Support Intel® NUC model:
NUC11TNKi3 / NUC11TNHi3 / NUC11TNBi3
NUC11TNKi5 / NUC11TNHi5 / NUC11TNBi5
NUC11TNKv5 / NUC11TNHv5 / NUC11TNBv5
NUC11TNKi7 / NUC11TNHi7 / NUC11TNBi7
NUC11TNKv7 / NUC11TNHv7 / NUC11TNBv7
Maximum TDP Support 28W
Dimensions 95 x 113.5 x 247.9 mm (W x D x H)
Drive Bays 2.5” SSD/HDD x 1 (up to 9.5mm)
Front I/O Opening Power button, USB Type-A port x2
Rear I/O Opening DC-In port, HDMI port x2, USB Type-A port x2, USB Type-C x2, LAN port x1
Antenna Fitting Holes 2
Security Kensington lock
Optional Power Adaptor AK-PD120-04M
Product Code A-NUC68-A1B / A-NUC68-M1B
Installation manual

GB, FR, DE, PT, ES, JP, CN

- 2021-05-12

The included AK-TC5026 thermal paste was a specifically chosen for its formula to be used within Akasa fanless cases. Consideration for high thermal conductivity is not the only property when considering the best thermal compound for Akasa fanless cases. The AK-TC5026 properties of ultra-thin bond lines, low-thermal resistance for superior thermal performance, and non-pressure dependency makes the AK-TC5026 the qualified TIM for use with Akasa fanless cases.