• Low thermal resistance for
hi-heat transfer
• Non-curing and non-electrically
conductive properties
• Conveniently included wipes
and spreader
Low Thermal Resistance for Hi-Heat
Transfer
Heat can easily be transferred from CPU or GPU to heatsink due to
its low thermal resistance for efficient performance. Getting the
most out of your CPU and air/liquid heatsink cooler.
Performance Comparison Under 100% Load
(Lower is Better)
Easy and Safe Application
Non-curing paste means no time required to wait for curing process
reaching its highest performance right from the get-go. Non-conductive
properties ensures that there is no electrical risk with components.
Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on
CPU or GPU for best efficiency. Wipes also included to clean old
paste to make sure a good bond is established with heatsink.

 

Application Thermally conductive compound
Thermal Conductivity 4.0 W/mK
Specific Gravity 2.6
Form Non-curing compound
Operating Temperature -50°C to 220°C
Thermal Impedance 0.07 (°C-cm²/W) @ 60 psi
Colour Grey
Viscosity 4,800,000 (mPa.s/ 22°C)
Weight 5g
Product Code AK-T505-5G
Installation manual

GB, FR, DE, PT, ES, JP, CN

- 2021-07-06