Press and Media

< VIEW ALL NEWS
Akasa at Raspberry Pi Partner Event & Product Expo 2026

Akasa will present fanless aluminium cases and thermal solutions for Raspberry Pi in Windsor, UK, from 12–14 October 2026.


September 21, 2026 | Company News

Akasa is pleased to attend the Raspberry Pi Partner Event & Product Expo 2026, taking place from 12–14 October in Windsor, United Kingdom.

As a Raspberry Pi Design Partner, we’ll join Raspberry Pi, fellow ecosystem partners and approved resellers to share ideas, discuss new applications and present our latest aluminium fanless cases and thermal solutions for Raspberry Pi platforms.

Supporting the Raspberry Pi Ecosystem

We develop thermal and enclosure solutions for Raspberry Pi platforms, with a focus on silent passive cooling, compact system integration and long-term reliability. Our cases are designed for applications including IoT, industrial automation, robotics, digital signage, POS and embedded computing.

Take a Closer Look at

Fermi CM5: 1U Fanless Case for Raspberry Pi Compute Module 5

The Fermi CM5 houses the Raspberry Pi Compute Module 5 and CM5 IO Board in a 1U fanless aluminium case measuring 185 x 93 x 43.6 mm. A custom thermal module passively cools systems up to 10W TDP, with internal space for an M.2 NVMe SSD and a 40-pin Raspberry Pi HAT. Its 1U height suits space-constrained edge installations in vision, signage and sensor applications.

Pi-5 Pro: Fanless Cooling for Raspberry Pi 5

The Pi-5 Pro is an aluminium enclosure with dual cooling cores to passively cool the Raspberry Pi 5 without a fan. Full I/O access and optional VESA or DIN rail mounting make it well suited to compact IoT, signage, POS and embedded applications.

Gem Pro: Fanless Cooling for Raspberry Pi 4 Model B

A forged aluminium case with a faceted top cover and a custom thermal kit that passively cools the Raspberry Pi 4. The Gem Pro has full I/O access and its compact, distinctive design make it a practical fit for smart home, media, retro gaming and embedded applications.

Maze Pro: Fanless Cooling for Raspberry Pi 4 Model B

Dual solid aluminium cores and thermal pads carry heat from the processor and power regulators to the aluminium body, while the Maze Pro top cover uses its distinctive maze pattern to add surface area for heat dissipation. A programmable power button and full I/O access, including GPIO, microSD, camera and display connectors, make it a practical fit for smart home, media and embedded applications.

We will also preview a new case for Raspberry Pi 5 with the Raspberry Pi AI HAT+ and Camera Module 3, alongside our power and display cables for Raspberry Pi.

Meet Us in Windsor

Date: 12-14 October 2026

Location: Windsor, United Kingdom

If you are attending, we look forward to seeing you. You can also contact us to arrange a meeting or discuss thermal or enclosure requirements for your Raspberry Pi project here.

RELATED PRODUCTS

PREVIOUS POST
Akasa Launches Newton N16: Compact Fanless Case for ASUS NUC 16 Pro
NEXT POST
No adaptors attached, Akasa is releasing Alder Lake, LGA1700 compatible CPU coolers!

FEATURED POSTS

CONTACT US

For any media enquires, please email: marketing@akasa.com.tw