1U Low-Profile CPU Cooler with Vapour Chamber Plate

• Compatible with Intel® LGA1700 / LGA1851 socket-based CPUs up to 125W TDP
• Copper heatsink with vapour chamber plate for maximum heat dissipation
• Compact footprint fits 1U servers and SFF systems with limited vertical clearance
• High-pressure side blower fan
• Secure spring-loaded screw mounting
• Pre-applied thermal paste

Vapour Chamber Copper Heatsink

Equipped with a copper VC plate, which uses a sealed two-phase heat transfer process where working fluid evaporates at the CPU contact area and condenses across the chamber surface, rapidly distributing heat laterally. This improves thermal efficiency, minimises hot spots and ensures uniform heat transfer into the copper fins for effective cooling.

High-Pressure Side Blower Fan

UL-certified, side blower fan generates high static pressure airflow to efficiently pull cool air through the dense heatsink fins and expel heat away from the CPU.

PWM control allows fan speeds from 1200 to 5500 RPM, while the two ball bearings ensure long-term operation in continuous-duty systems.

Pre-Applied Thermal Paste

Pre-applied high-performance thermal interface material (TIM) ensures optimal heat transfer right out of the box, eliminating the need for manual application and reducing installation time.