Perfect for bonding heatsinks to chipsets or other components requiring strong fixing in a hot environment. 80x80mm.
TIM Wipe Kit
All-in-one chipset preparation kit complete with 5g of high-performance AK-455 thermal compound, a spreader and 5 individually packaged cleaning wipes pre-moistened with TIM Clean fluid. Perfect for every PC enthusiast.
10 individually packaged cleaning wipes come moistened with TIM Clean fluid to remove all thermal interfaces. Convenient solution for cleaning CPU, GPU and chipset surfaces, or heatsink bases for the application of new thermal interface. Safe citrus-based solvent leaves no residue.
When every degree matters, get more from your cooler. Originally bundled with Akasa’s premium fanless cases since 2017, Pro-grade+ 5026 provides hi-reliability and excellent thermal performance, even at lo-pressures.
Thermal gap filler
Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks.
Two sizes: 1.5 and 5mm thickness
AK-TT300-01 / AK-TT300-02
5g syringe of high performance thermal compound AK-455 complete with a spreader card and 125ml of TIM Clean fluid for professional chipset preparation. Must have accessory for every PC enthusiast.
Get more from your cooler. AMD recommended Pro-grade+ 5022 provides ultimate thermal performance even at low pressures. 3.5g with spreader card.
Get more from your cooler. Pro-grade 460 Silicone-technology, evolutionary thermal compound for outstanding thermal performance. 3.5g with spreader card.
Performance Compound 455
Get more from your cooler. New improved formula 455 delivers high thermal performance; even at low pressures. 5g with spreader card.
Silver Compound 450
High performance silver based thermal compound with high thermal conductivity, 5g syringe complete with spreader card.
Thermal Interface Cleaner, fluid for all thermal interfaces. Citrus based solvent safe to use. Perfect for cleaning CPU, GPU or base heatsink.