When every degree matters, get more from your cooler. Pro-grade+ silicone-tech evolution 5026 provides ultra thin bond lines, hi-thermal conductivity and hi-temperature stability, creating the ultimate thermal compound. It’s suitable for all CPUs and applications, from fanless cases to hi-performance coolers.

• Outperformed similar compounds when the CPU was under load
• Thermally conductive technology behind Akasa’s fanless case evolution
• Ultra-thin bond lines & lo-thermal resistance for superior thermal performance
• Non-electrically conductive & non pressure dependant compound
• RoHS compliant
• Easy-to-use syringe applicator and spreader