supports 65W TDP processors for
both Intel® and AMD Mini-ITX platforms
Intel® LGA1700 Ready
Perfect for the Intel® Alder Lake processors up to 65W Thermal Design Point (TDP) with increased contact surface area, allowing for more heat to be dissipated at a time.
Bi-symmetrical extruded fins on either side of the case maximise the surface area of the exterior for increased heat dissipation. Coupled with internally hi-efficient passive thermal module and heat pipes to ensure the Thermal Design Power (TDP) is met.
True Silent Experience
Fanless CPU design eliminates the need for noisy mechanical fans so that true silence can be achieved. Paired with the use of Solid State Drives, one can truly immerse themselves in the experience of soundless acoustics. Breathability, provided by multi-functional apertures which optimise natural convectional airflow, is fused with contemporary design for a minimalist yet functional case.
Universal Socket Fitting &
Easily adjustable thermal module with 4 copper heat pipes which are universally compatible with Intel® and AMD boards. Superbly engineered for maximum efficiency and ease of use.
for an Array of Applications
Geometrically balanced case features a black anodised aluminium body with diamond-edge finish, combined with bi-symmetrical extruded fins for a beautifully crafted, modern case. Perfect for a wide range of applications and environments.