Passive Low-Profile CPU Cooler (25.5mm), Screw Mount, TDP 180W, Intel
High-performance, low-profile cooler with aluminium fins, copper base and four copper heatpipes. Supports Intel® LGA3647 sockets with narrow ILM. Suitable for Intel® Xeon® Scalable Family processors up to 180W TDP. Ideal for 1U rackmount servers and low-profile workstations.
1U passive cooler for Intel® Xeon® LGA3647 CPUs with narrow ILM (Independent Loading Mechanism). Features a skived aluminium fin heatsink with a copper base and four copper heatpipes to rapidly transfer heat away from the processor. Supports Skylake-SP and Cascade Lake-SP/W based Intel® Xeon® Scalable CPUs (Platinum, Gold, Silver or Bronze series). High-performance server and workstation cooling up to 180W TDP.
All passive heatsinks depend on appropriate chassis airflow for efficient cooling.
• 1U rackmount server Intel® Xeon® LGA3647 cooling solution
• Skived aluminium fins, copper base and four copper heatpipes
• Supports up to 180W TDP
• Hi-performance thermal compound supplied
• Narrow ILM (Independent Loading Mechanism)
| Socket Type | Intel LGA3647 Narrow ILM |
|---|---|
| Suggested TDP (W) | 180 |
| Cooler Dimensions | 108 x 78 x 25.5 mm |
| Heatsink Material | Aluminium fins with copper base and four copper heatpipes |
| Installation | Mounting screw (back plate included) |
| Thermal Interface | Pre-applied |
| Weight | 220.5g |
| Product Code | AK-CC9308 |
